The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Oct. 31, 2022
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Ati Technologies Ulc, Markham, CA;
Rajagopalan Venkatramani, Hsinchu, TW;
Liane Martinez, Markham, CA;
Gabriel Wong, Markham, CA;
Renato Dimatula Gaddi, Markham, CA;
Advanced Micro Devices, Inc., Santa Clara, CA (US);
ATI Technologies ULC, Markham, CA;
Abstract
The disclosed computer-implemented method can include defining, by at least one processor, one or more boundary conditions. The method can additionally include importing, by the at least one processor, one or more tiles outlines that at least define importing, by the at least one processor, one or more tiles outlines that at least define a cell hierarchy for one or more chiplets. The method can also include defining, by the at least one processor and based at least in part on the one or more tiles outlines, one or more cells of the one or more chiplets at least in part by automatically filling one or more slave cells of the one or more chiplet with a same bump pattern as a master cell of the one or more chiplets. The method can further include generating, by the at least one processor and based at least in part on the defined boundary conditions and the defined one or more cells, a floorplan and bump placement for a package design. Various other methods, systems, and computer-readable media are also disclosed.