The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 30, 2023
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Ati Technologies Ulc, Thornhill, CA;
Suming Hu, Santa Clara, CA (US);
Roden Topacio, Ontario, CA;
Manish Dubey, Austin, TX (US);
Jianguo Li, Ontario, CA;
Advanced Micro Devices, Inc., Santa Clara, CA (US);
ATI Technologies ULC, Markham, CA;
Abstract
A chip package includes a package substrate, an integrated circuit (IC) die disposed on the package substrate, and a lid assembly disposed over the IC die. The lid assembly includes a top plate having a lower surface facing the IC die and an outer shoulder. The lid assembly also includes a retainer having a lower surface secured to the package substrate and an inner shoulder retaining to the outer shoulder. The inner shoulder is configured to limit upward movement of the top plate, and expansion of the retainer is decoupled from expansion of the top plate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile