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For the Inventor, By the Inventor

Olympia, WA, United States of America

Robin A Steinbrecher

USPTO Granted Patents = 15 

 

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 60(Granted Patents)


Company Filing History:

goldMedal15 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2002-2023

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15 patents (USPTO):
1. 11543868 - Apparatus and method to provide a thermal parameter report for a multi-chip package (2023-01-03),
2. 10877530 - Apparatus and method to provide a thermal parameter report for a multi-chip package (2020-12-29),
3. 10667438 - Maintenance prediction of electronic devices using periodic thermal evaluation (2020-05-26),
4. 10612980 - Temperature sensing based flow monitoring and fault detection (2020-04-07),
5. 10168749 - Cooling using adjustable thermal coupling (2019-01-01),
6. 9971890 - Securing thermal management parameters in firmware from cyber attack (2018-05-15),
7. 9494996 - Processor having frequency of operation information for guaranteed operation under high temperature events (2016-11-15),
8. 9355249 - Securing thermal management parameters in firmware from cyber attack (2016-05-31),
9. 9116050 - Sensor-based thermal specification enabling a real-time metric for compliance (2015-08-25),
10. 8538598 - Power and thermal optimization of processor and cooling (2013-09-17),
11. 8260474 - Sensor-based thermal specification enabling a real-time metric for compliance (2012-09-04),
12. 7984250 - Dynamic updating of thresholds in accordance with operating conditons (2011-07-19),
13. 7269481 - Method and apparatus for memory bandwidth thermal budgetting (2007-09-11),
14. 6817442 - Acoustically insulated bezel (2004-11-16),
15. 6364761 - Redundant cooling system for computer assembly (2002-04-02),

Title: The Innovations of Robin A Steinbrecher

Introduction

Robin A Steinbrecher is a notable inventor based in Olympia, WA (US). He has made significant contributions to the field of technology, particularly in the area of thermal management for multi-chip packages. With a total of 15 patents to his name, Steinbrecher's work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is an "Apparatus and method to provide a thermal parameter report for a multi-chip package." In this embodiment, a processor includes at least one core and power management logic. The power management logic is designed to receive temperature data from a plurality of dies within a package that includes the processor. It determines the smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is based on a respective thermal control temperature associated with the die and also on respective temperature data associated with the die. The power management logic generates a thermal report that includes the smallest temperature control margin and stores the thermal report. Other embodiments are described and claimed.

Career Highlights

Steinbrecher has had a distinguished career, working at Intel Corporation, where he has been able to apply his innovative ideas and technical expertise. His work has contributed to advancements in processor technology and thermal management systems.

Collaborations

Throughout his career, Steinbrecher has collaborated with talented individuals such as Sandeep Ahuja and Susan F Smith. These collaborations have further enhanced his ability to innovate and develop cutting-edge technologies.

Conclusion

Robin A Steinbrecher is a prominent inventor whose work in thermal management has led to significant advancements in technology. His contributions continue to influence the industry and inspire future innovations.

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