Intel Corporation

Robin A Steinbrecher

Sandeep Ahuja

Krishnakanth Venkata Sistla

Tessil Thomas

Susan F Smith

Casey R Winkel

David J Ayers

Phani Kumar Kandula

Michael Berktold

Timothy Y Kam

David Richardson

Howard Chin

Rahul Khanna

Ankush Varma

Russell S Aoki

Vivek Garg

Kai Cheng

Warren Morrow

Devdatta P Kulkarni

Janusz Jurski

Stephen W Montgomery

Mariusz Oriol

Nishi Ahuja

Chris Poirier

David S De Lorenzo

Ramkumar Nagappan

Alan W Tate

Ralph W Jensen

Donovan D Van Sleet

Tozer J Bandorawalla

Piotr Sawicki

Shankar Krishnan

Fernando A Lopez

Christian Le

Martin Mark T Rowland

In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

Apparatus and method to provide a thermal parameter report for a multi-chip package

A method for determining whether to perform maintenance for an electronic device includes generating a baseline characterization of thermal performance for a heat-generating component of the electronic device at a baseline date. The method also includes generating an assessment characterization of the thermal performance at an assessment date after the baseline date. The method further includes generating a historical trend that includes the baseline characterization and the assessment characterization. Additionally, the method includes determining whether to perform maintenance for the heat-generating component based on the historical trend and a specified maintenance parameter.

Maintenance prediction of electronic devices using periodic thermal evaluation

An apparatus is provided which comprises: a first circuitry to receive a measurement of a first temperature of a section of a computing device during a first loading condition of the computing device, and to receive a measurement of a second temperature of the section of the computing device during a second loading condition of the computing device; and a second circuitry to detect a potential fault in a cooling system to cool the computing device, based at least in part on the first temperature and the second temperature.

Temperature sensing based flow monitoring and fault detection

Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

Cooling using adjustable thermal coupling

Methods and systems may provide for identifying a thermal management setting in a computing system, and comparing the thermal management setting to valid configuration information. In addition, the thermal management setting may be modified if it does not comply with the valid configuration information, wherein the modification can cause the thermal management setting to comply with the valid configuration information. Additionally, a threat risk notification can be initiated in order to notify users of the non-compliance.

Securing thermal management parameters in firmware from cyber attack

A processor is described having a semiconductor chip having non volatile storage circuitry. The non volatile storage circuitry has information identifying a maximum operational frequency of the processor at which the processor's operation is guaranteed for an ambient temperature that corresponds to an extreme thermal event.

Processor having frequency of operation information for guaranteed operation under high temperature events

An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Sensor-based thermal specification enabling a real-time metric for compliance

In some embodiments a processor is adapted to store a relationship of power as a function of temperature and voltage, wherein the stored relationship data is to be used for managing power in a system including the processor. Other embodiments are described and claimed.

Power and thermal optimization of processor and cooling

In some embodiments, a memory control device includes a sensor positioned remotely from a memory device, a register to store an offset value, the offset value corresponding to a difference between a temperature reading of the sensor and an estimated actual temperature of the memory device, and a controller to control an operation of the memory device, wherein the controller is configured to read the offset value from the register and control the operation of the memory device in accordance with the offset value. The controller may be configured to dynamically update the offset value during an operation of the memory device. Other embodiments are disclosed and claimed.

Dynamic updating of thresholds in accordance with operating conditons

An electronic system includes a device and a controller to the device. The controller is adapted to calculate a temperature estimate of the device and to control access to the device in accordance with the calculated temperature estimate.

Method and apparatus for memory bandwidth thermal budgetting

A portion of a chassis comprised of a material forming a portion of the exterior of the chassis and a high-density flexible material adjacent an inner surface of the portion of the chassis with air holes formed contiguously through both the portion of the chassis and the high-density flexible material.

Acoustically insulated bezel

An improved cooling assembly is disclosed, which includes a chassis enclosing a duct. The duct has a first end and a second end. A first fan is positioned at the first end of the duct and a second fan is positioned at the second end of the duct. A fan failure vent is positioned along a first side of the duct between the first and second fans.

Redundant cooling system for computer assembly

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Olympia, WA, United States of America

Robin A Steinbrecher