The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Dec. 01, 2016
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Russell S. Aoki, Tacoma, WA (US);
Devdatta P. Kulkarni, University Place, WA (US);
Alan W. Tate, Puyallup, WA (US);
Robin A. Steinbrecher, Olympia, WA (US);
Ralph W. Jensen, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); F28F 9/26 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); F28F 9/266 (2013.01); H01L 23/40 (2013.01); H01L 23/473 (2013.01); H05K 1/0203 (2013.01); H05K 1/18 (2013.01); H05K 7/2049 (2013.01); H05K 7/20254 (2013.01); H05K 7/20509 (2013.01); F28F 2280/10 (2013.01);
Abstract
Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.