Fort Collins, CO, United States of America

Richard Thomas Schultz

This inventor holds 84 USPTO granted patents and 8 published patent applications and 7 EPO patents, primarily in Semiconductor Design (CPC class H01L23-5226). Top assignees: Advanced Micro Devices Corporation, Lsi Logic Corporation, Lsi Corporation. Active years: 1999-2026.

USPTO Granted Patents = 84 (Patent Applications = 8)

% Patents Active = 82.1

EPO Patents = 7 (Patent Applications = 23)

Average Co-Inventor Count = 1.3

ph-index = 13

Forward Citations = 587(Granted Patents)

Forward Citations (Not Self Cited) = 510(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Fort Collins, OH (US) (2019)
Fort Collins, CO (US) (1999 - 2024)
Ft. Collins, CO (US) (2003 - 2024)

Company Filing History:

45 out of 13,146

Advanced Micro Devices Corporation

patents

25 out of 3,715

Lsi Logic Corporation

where one patent can have more than one assignee

Years Active: 1999-2026

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Areas of Expertise:

3D Die Stacking

Cross Field-Effect Transistors

Power Grid Architecture

EUV Lithography

SRAM Cell Layout

Integrated Circuits

Double Pattern Lithography

FinFET Device

Capacitor Architecture

Metal Density Distribution

Gate All Around Device

Local Interconnect

84 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12721128 - Standard cell layout architectures and drawing styles for 5NM and beyond (2026-08-25),

2. 12713624 - BACKSIDE POWERTD (2026-08-18),

3. 12666713 - Double side transistors on same silicon wafer (2026-06-23),

4. 12641862 - Three-dimensional cross field effect self-aligned transistors with frontside and backside power connections (2026-05-26),

5. 12575449 - Backside power delivery and power grid pattern to support 3D die stacking (2026-03-10),

6. 12564040 - Power via with reduced resistance (2026-02-24),

7. 12513943 - Apparatuses and systems for offset cross field-effect transistors (2025-12-30),

8. 12455999 - Metal zero power ground stub route to reduce cell area and improve cell placement at the chip level (2025-10-28),

9. 12308370 - Cross field effect transistors (XFETs) in integrated circuits (2025-05-20),

10. 12274046 - Cross FET SRAM cell layout (2025-04-08),

11. 12205897 - Standard cell design architecture for reduced voltage droop utilizing reduced contacted gate poly pitch and dual height cells (2025-01-21),

12. 11934764 - Routing and manufacturing with a minimum area metal structure (2024-03-19),

13. 11881393 - Cross field effect transistor library cell architecture design (2024-01-23),

14. 11862640 - Cross field effect transistor (XFET) library architecture power routing (2024-01-02),

15. 11778803 - Cross FET SRAM cell layout (2023-10-03),

Title: Richard Thomas Schultz - Pioneering Inventor from Fort Collins

Introduction: Richard Thomas Schultz is a renowned inventor hailing from Fort Collins, Colorado. His innovative spirit and dedication to creating groundbreaking solutions have made him a prominent figure in the world of inventions.

Latest Patents: Richard Thomas Schultz holds several patents in various fields, showcasing his versatility and ingenuity as an inventor. His recent patents focus on sustainable technologies and advanced materials.

Career Highlights: With a career spanning over two decades, Richard Thomas Schultz has made significant contributions to the fields of renewable energy, environmental conservation, and consumer electronics. His inventions have revolutionized the way we approach everyday challenges.

Collaborations: Throughout his career, Richard Thomas Schultz has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His partnerships have been instrumental in turning innovative ideas into tangible products that benefit society.

Conclusion: Richard Thomas Schultz's passion for innovation and his relentless pursuit of excellence have established him as a trailblazer in the world of inventions. His work continues to inspire aspiring inventors and shape the future of technology.