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For the Inventor, By the Inventor

Parkman, OH, United States of America

Richard F Hill

This inventor holds 27 USPTO granted patents and 13 published patent applications and 3 EPO patents, primarily in Thermal Interface Materials. Top assignees: Laird Technologies Gmbh, Thermagon, Inc., Other. Active years: 2002-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Richard F Hill. Retrieved from https://idiyas.com/inventor/richard-f-hill

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 92.6

 

Average Co-Inventor Count = 2.2

ph-index = 13

Forward Citations = 423(Granted Patents)


Location History:

  • Cleveland, OH (US) (2005 - 2014)
  • Parkman, OH (US) (2002 - 2024)

Company Filing History:

goldMedal19 out of 287 
 
Laird Technologies Gmbh
 patents
silverMedal6 out of 6 
 
Thermagon, Inc.
 patents
bronzeMedal2 out of 834,513 
Other
 patents

Years Active: 2002-2024

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Areas of Expertise:
Thermal Interface Materials
Heat Dissipation
Thermoelectric Modules
Thermal Joints
Compliant Assemblies
Multilayer Structures
Heat Spreaders
Circuit Assemblies
Memory Modules
Thermal Conductivity
Flexible Assemblies
Microelectronic Components
27 patents (USPTO):Explore Patents
1. 12033971 - Compressible foamed thermal interface materials and methods of making the same (2024-07-09),
2. 11776928 - Compressible foamed thermal interface materials and methods of making the same (2023-10-03),
3. 11776868 - Methods for establishing thermal joints between heat spreaders or lids and heat sources (2023-10-03),
4. 11610831 - Methods for establishing thermal joints between heat spreaders or lids and heat sources (2023-03-21),
5. 11276662 - Compressible foamed thermal interface materials and methods of making the same (2022-03-15),
6. 10964617 - Methods for establishing thermal joints between heat spreaders or lids and heat sources (2021-03-30),
7. 10600714 - Methods for establishing thermal joints between heat spreaders or lids and heat sources (2020-03-24),
8. 10373891 - Methods for establishing thermal joints between heat spreaders or lids and heat sources (2019-08-06),
9. 9515004 - Thermal interface materials (2016-12-06),
10. 9330998 - Thermal interface material assemblies and related methods (2016-05-03),
11. 9322580 - Circuit assemblies including thermoelectric modules (2016-04-26),
12. 9258928 - Assemblies and methods for dissipating heat from handheld electronic devices (2016-02-09),
13. 9222735 - Compliant multilayered thermally-conductive interface assemblies (2015-12-29),
14. 8837151 - Memory modules including compliant multilayered thermally-conductive interface assemblies (2014-09-16),
15. 8649179 - Circuit assemblies including thermoelectric modules (2014-02-11),

Title: The Inventor Profile of Richard F Hill

Introduction: Richard F Hill is a renowned inventor based in Parkman, Ohio, known for his groundbreaking contributions to various industries.

Latest Patents: Richard F Hill holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: Throughout his career, Richard F Hill has demonstrated a keen ability to identify gaps in the market and develop unique solutions to address them. His inventions have not only improved efficiency but have also enhanced the quality of life for many individuals.

Collaborations: Richard F Hill has collaborated with leading companies and research institutions to bring his inventions to the market successfully. His partnerships have been instrumental in turning his ideas into tangible products that have made a significant impact.

Conclusion: Richard F Hill's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor in the industry. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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