The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Feb. 05, 2011
Jeffrey Gerard Hershberger, Shaker Heights, OH (US);
Richard F. Hill, Parkman, OH (US);
Robert Michael Smythe, Ewing, NJ (US);
Michael G. Sutsko, Avon Lake, OH (US);
Jeffrey Gerard Hershberger, Shaker Heights, OH (US);
Richard F. Hill, Parkman, OH (US);
Robert Michael Smythe, Ewing, NJ (US);
Michael G. Sutsko, Avon Lake, OH (US);
Laird Technologies, Inc., Earth City, MO (US);
Abstract
A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.