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For the Inventor, By the Inventor

Earth City, MO, United States of America

Laird Technologies Gmbh


USPTO Granted Patents = 287

% Expired Patents = 26.5


Trademarks = 32

Forward Citations = 2,300

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250 inventors (with patents filed for the assignee):

goldMedal Jason L Strader (36 out of 42 patents)

silverMedal Gerald Robert English (25 out of 25 patents)

bronzeMedal Richard F Hill (19 out of 27 patents)

4.  Ayman Duzdar (15 out of 20 patents)

5.  Kok Jiunn Ng (15 out of 18 patents)

6.  Eugene Anthony Pruss (10 out of 11 patents)

7.  Karen Bruzda (10 out of 11 patents)

8.  Philip Van Haaster (10 out of 10 patents)

9.  John Song (9 out of 10 patents)

10.  Kenneth M Robinson (9 out of 11 patents)

11.  Paul Francis Dixon (9 out of 9 patents)

12.  Hasan Yasin (8 out of 16 patents)

13.  Hoang Dinh Do (8 out of 8 patents)

14.  Paul W Crotty, Jr (8 out of 8 patents)

15.  James E Kline (8 out of 9 patents)


Core Competencies:
Thermal Management
EMI Shielding
Radomes
Interface Materials
Conductive Absorbers
Antenna Systems
Board Level Shields
Heat Spreaders
Electronic Components
Thermal Interface
Flexible Shields
Conductive Foam

287 patents:

1. 12725916 - Low dielectric, low loss radome (2026-09-01),
2. D1142238 - FRAME FOR A SHIELDING ASSEMBLY (2026-08-18),
3. 12641764 - Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes (2026-05-26),
4. 12519219 - Low dielectric, low loss radomes and materials for low dielectric, low loss radomes (2026-01-06),
5. D1101702 - Edging for materials (2025-11-11),
6. 12369291 - Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide (2025-07-22),
7. 12289876 - Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder (2025-04-29),
8. 12040306 - Systems of applying materials to components (2024-07-16),
9. 12033971 - Compressible foamed thermal interface materials and methods of making the same (2024-07-09),
10. 12022642 - Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes (2024-06-25),
11. 11984570 - Thermal management and/or EMI mitigation materials including coated fillers (2024-05-14),
12. 11955438 - Thermally-conductive electromagnetic interference (EMI) absorbers (2024-04-09),
13. 11903177 - Board level shield (BLS) frames including pickup members with pickup areas rotatable in place when drawn (2024-02-13),
14. 11864366 - Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder (2024-01-02),
15. 11848491 - Low dielectric, low loss radomes (2023-12-19),
Laird Technologies GmbH, based in Earth City, MO, specializes in advanced solutions for electromagnetic interference (EMI) management. The company focuses on developing and manufacturing a range of products including thermal management systems, EMI shielding materials, radomes, and interface materials. Their expertise extends to conductive absorbers, antenna systems, board level shields, and heat spreaders, catering to diverse industries that require reliable performance in challenging environments.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Laird Technologies Gmbh
287 Patents

#1 in Earth City, MO

#21 in Missouri

#1,520 in US

#3,084 in the World

Earth City, MO (US)
Earth City, MO, United States of America

Laird Technologies Gmbh

Forward Citations = 2,300

250 inventors:

goldMedal Jason L Strader (36 out of 42 patents)

silverMedal Gerald Robert English (25 out of 25 patents)

bronzeMedal Richard F Hill (19 out of 27 patents)

4.  Ayman Duzdar (15 out of 20 patents)

5.  Kok Jiunn Ng (15 out of 18 patents)

Please report any incorrect information to [email protected]
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