IDiyas

For the Inventor, By the Inventor

Hildesheim, Germany

Laird Technologies Gmbh


USPTO Granted Patents = 283


Trademarks = 42

Forward Citations = 2,221

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247 inventors (with patents filed for the assignee):

goldMedal Jason L Strader (36 out of 42 patents)

silverMedal Gerald Robert English (24 out of 24 patents)

bronzeMedal Richard F Hill (19 out of 27 patents)

4.  Ayman Duzdar (15 out of 20 patents)

5.  Kok Jiunn Ng (15 out of 18 patents)

6.  Eugene Anthony Pruss (10 out of 11 patents)

7.  Karen Bruzda (10 out of 11 patents)

8.  Philip Van Haaster (10 out of 10 patents)

9.  John Song (9 out of 10 patents)

10.  Kenneth M Robinson (9 out of 11 patents)

11.  Paul Francis Dixon (9 out of 9 patents)

12.  Hasan Yasin (8 out of 16 patents)

13.  Paul W Crotty, Jr (8 out of 8 patents)

14.  James E Kline (8 out of 9 patents)

15.  Cheikh T Thiam (7 out of 11 patents)


Core Competencies:
Thermal Interface Materials
Electromagnetic Interference Mitigation
Thermal Management
Compressible Foamed Materials
Silicon Carbide Absorbers
Carbon Nanotubes
Board Level Shields
Energy Absorption Devices
Low Dielectric Radomes
Heat Spreaders
Detachable Pickup Members
Omnidirectional Antennas

283 patents:

1. D1101702 - Edging for materials (2025-11-11),
2. 12369291 - Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide (2025-07-22),
3. 12289876 - Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder (2025-04-29),
4. 12040306 - Systems of applying materials to components (2024-07-16),
5. 12033971 - Compressible foamed thermal interface materials and methods of making the same (2024-07-09),
6. 12022642 - Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes (2024-06-25),
7. 11984570 - Thermal management and/or EMI mitigation materials including coated fillers (2024-05-14),
8. 11955438 - Thermally-conductive electromagnetic interference (EMI) absorbers (2024-04-09),
9. 11903177 - Board level shield (BLS) frames including pickup members with pickup areas rotatable in place when drawn (2024-02-13),
10. 11864366 - Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder (2024-01-02),
11. 11848491 - Low dielectric, low loss radomes (2023-12-19),
12. D1000986 - Frame for shielding assembly (2023-10-10),
13. 11776928 - Compressible foamed thermal interface materials and methods of making the same (2023-10-03),
14. 11776868 - Methods for establishing thermal joints between heat spreaders or lids and heat sources (2023-10-03),
15. D999405 - Material having edging (2023-09-19),
Laird Technologies GmbH is a technology company specializing in providing innovative solutions for wireless communication and electromagnetic interference (EMI) control. With a global presence, Laird Technologies offers a wide range of products and services including antenna systems, thermal management solutions, electromagnetic shielding materials, and wireless modules. Their solutions are designed to meet the unique needs of various industries such as automotive, telecommunications, medical, and industrial. Visit their website for more information about their products and services.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 9 2025

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283 Patents

#1 in Hildesheim

#229 in Germany

#3,032 in the World

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Hildesheim, Germany

Laird Technologies Gmbh

Forward Citations = 2,221

247 inventors:

goldMedal Jason L Strader (36 out of 42 patents)

silverMedal Gerald Robert English (24 out of 24 patents)

bronzeMedal Richard F Hill (19 out of 27 patents)

4.  Ayman Duzdar (15 out of 20 patents)

5.  Kok Jiunn Ng (15 out of 18 patents)

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