The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2016

Filed:

Feb. 10, 2014
Applicant:

Laird Technologies, Inc., Earth City, MO (US);

Inventors:

Jeffrey Gerard Hershberger, Shaker Heights, OH (US);

Richard F. Hill, Parkman, OH (US);

Robert Michael Smythe, Ewing, NJ (US);

Michael G. Sutsko, Avon Lake, OH (US);

Assignee:

Laird Technologies, Inc., Earth City, unknown;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F25B 21/02 (2006.01); H05K 1/02 (2006.01); H01L 23/38 (2006.01); H01L 35/32 (2006.01); H01L 35/30 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
F25B 21/02 (2013.01); H01L 23/38 (2013.01); H01L 35/30 (2013.01); H01L 35/32 (2013.01); H05K 1/0203 (2013.01); H05K 7/205 (2013.01); H01L 2224/48091 (2013.01); H05K 1/141 (2013.01); H05K 1/182 (2013.01); H05K 3/0061 (2013.01); H05K 2201/10219 (2013.01); Y10T 29/4913 (2015.01);
Abstract

A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.


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