The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Aug. 19, 2014
Applicant:
Laird Technologies, Inc., Earth City, MO (US);
Inventors:
Jason L. Strader, Cleveland, OH (US);
Richard F. Hill, Parkman, OH (US);
Assignee:
Laird Technologies, Inc., Earth City, MO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H01L 23/42 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01);
Abstract
A thermal interface material assembly generally includes a substrate and one or more pillars protruding outwardly away from the substrate. A thermally-conductive heat path is at least partially defined by the substrate and the one or more thermally-conductive pillars, whereby heat may be transferable along the thermally-conductive heat path from a heat source of an electronic device.