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EPO Patents = 1

Forward Citations = 188

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4 inventors (with patents filed for the assignee):

Richard F Hill (6 out of 27 patents)

Jason L Strader (4 out of 42 patents)

Forest Hampton, Iii (2 out of 5 patents)

4. James Latham (1 out of 1 patent)

6 patents: Sort by Forward Citations

1. 7369411 - Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink (2008-05-06),

2. 7078109 - Heat spreading thermal interface structure (2006-07-18),

3. 6849941 - Heat sink and heat spreader assembly (2005-02-01),

4. 6761928 - Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink (2004-07-13),

5. 6617517 - Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink (2003-09-09),

6. 6372997 - Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink (2002-04-16),

Thermagon, Inc. specializes in the design and manufacturing of thermal interface materials for the electronics industry. With expertise in thermal management solutions, the company offers a range of innovative products to improve heat dissipation and enhance device performance. Thermagon's advanced materials are trusted by leading technology companies worldwide for their reliability and efficiency.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

6 Patents

#219 in Cleveland, OH

#1,711 in Ohio

#43,729 in US

Cleveland, OH, United States of America

Thermagon, Inc.

Forward Citations = 188

4 inventors:

Richard F Hill (6 out of 27 patents)

Jason L Strader (4 out of 42 patents)

Forest Hampton, Iii (2 out of 5 patents)

4. James Latham (1 out of 1 patent)

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