The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2006

Filed:

Jul. 07, 2004
Applicants:

Richard Hill, Parkman, OH (US);

Jason Strader, Cleveland, OH (US);

James Latham, Lakewood, OH (US);

Inventors:

Richard Hill, Parkman, OH (US);

Jason Strader, Cleveland, OH (US);

James Latham, Lakewood, OH (US);

Assignee:

Thermagon Inc., Cleveland, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/42 (2006.01); B32B 3/02 (2006.01); B32B 7/04 (2006.01); B32B 15/01 (2006.01);
U.S. Cl.
CPC ...
Abstract

The thermal interface structure of the present invention is suited for use in a non-referenced die system between a heat source and heat sink spaced up to 300 mils apart and comprises a plurality of layers including a core body of high conductivity metal or metal alloy having opposite sides, a soft thermal interface layer disposed on one side of the core body for mounting against the heat sink and a thin layer of a phase change material disposed on the opposite side of the core body for mounting against the heat source wherein the surface area dimension (footprint) of the core body is substantially larger than the surface area of the heat source upon which the phase change material is mounted to minimize the thermal resistance between the heat source and the heat sink and wherein said soft thermal interface layer is of a thickness sufficient to accommodate a variable spacing between the heat source and the heat sink of up to 300 mils.


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