The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Mar. 15, 2013
Applicant:

Laird Technologies, Inc., Chesterfield, MO (US);

Inventors:

Jason L. Strader, Cleveland, OH (US);

Karen J. Bruzda, Cleveland, OH (US);

Richard F. Hill, Parkman, OH (US);

Assignee:

LAIRD TECHNOLOGIES, INC., Chesterfield, MO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/42 (2006.01); F28F 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4275 (2013.01); H01L 23/42 (2013.01); F28F 2013/006 (2013.01); H01L 2924/0002 (2013.01); Y10T 156/10 (2015.01);
Abstract

A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.


Find Patent Forward Citations

Loading…