IDiyas

For the Inventor, By the Inventor

Wuppertal, Germany

Reimund Engl

USPTO Granted Patents = 18 

Average Co-Inventor Count = 5.6

ph-index = 3

Forward Citations = 36(Granted Patents)


Location History:

  • Nuremberg, DE (2007)
  • Nürnberg, DE (2008)
  • Regensberg, DE (2010)
  • Regensburg, DE (2010 - 2015)
  • Munich, DE (2014 - 2024)

Company Filing History:

goldMedal18 out of 14,705 
 
Infineon Technologies Ag
 patents

Years Active: 2007-2024

Loading Chart...
18 patents (USPTO):
1. 12033972 - Chip package, method of forming a chip package and method of forming an electrical contact (2024-07-09),
2. 10978418 - Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer (2021-04-13),
3. 10672678 - Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package (2020-06-02),
4. 10497634 - Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound (2019-12-03),
5. 10461056 - Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact (2019-10-29),
6. 9941181 - Chip package and method of forming a chip package (2018-04-10),
7. 9059083 - Semiconductor device (2015-06-16),
8. 8835319 - Protection layers for conductive pads and methods of formation thereof (2014-09-16),
9. 8642408 - Semiconductor device (2014-02-04),
10. 8330252 - Integrated circuit device and method for the production thereof (2012-12-11),
11. 8110906 - Semiconductor device including isolation layer (2012-02-07),
12. 7955901 - Method for producing a power semiconductor module comprising surface-mountable flat external contacts (2011-06-07),
13. 7868465 - Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier (2011-01-11),
14. 7705441 - Semiconductor module (2010-04-27),
15. 7675146 - Semiconductor device with leadframe including a diffusion barrier (2010-03-09),

Title: Reimund Engl: Innovator in Chip Packaging Technology

Introduction

Reimund Engl is a prominent inventor based in Wuppertal, Germany. He has made significant contributions to the field of chip packaging technology, holding a total of 18 patents. His work focuses on methods that enhance the efficiency and reliability of electrical contacts in semiconductor devices.

Latest Patents

Engl's latest patents include innovative methods for forming chip packages and electrical contacts. One notable patent describes a method of forming an electrical contact that involves depositing a passivation layer over a metal surface using atomic layer deposition. This passivation layer contains aluminum oxide and is designed to improve the electrical contact with a metal contact structure made of copper. Another patent outlines a method for forming a chip package that incorporates a protective layer and a metal contact structure, ensuring optimal performance and durability.

Career Highlights

Reimund Engl has built a successful career at Infineon Technologies AG, where he has been instrumental in advancing chip packaging technologies. His expertise in the field has led to numerous innovations that have been recognized within the industry. His contributions have not only enhanced product performance but have also paved the way for future advancements in semiconductor technology.

Collaborations

Engl has collaborated with notable colleagues such as Joachim Mahler and Michael Bauer. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor sector.

Conclusion

Reimund Engl's work in chip packaging technology exemplifies the impact of innovation in the semiconductor industry. His patents and collaborations continue to influence the field, showcasing the importance of research and development in driving technological progress.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…