The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2018
Filed:
May. 19, 2017
Infineon Technologies Ag, Neubiberg, DE;
Heinrich Koerner, Bruckmuehl, DE;
Michael Bauer, Nittendorf, DE;
Reimund Engl, Munich, DE;
Michael Huettinger, Munich, DE;
Werner Kanert, Holzkirchen, DE;
Joachim Mahler, Regensburg, DE;
Brigitte Ruehle, Holzkirchen, DE;
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Abstract
In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically contacting the chip metal surface, and packaging material including a contact layer being in physical contact with the chip metal surface and/or with the metal contact structure; wherein at least in the contact layer of the packaging material, a summed concentration of chemically reactive sulfur, chemically reactive selenium and chemically reactive tellurium is less thanatomic parts per million.