Munich, Germany

Michael Huettinger


Average Co-Inventor Count = 8.8

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018-2024

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6 patents (USPTO):

Title: Innovations by Michael Huettinger

Introduction

Michael Huettinger is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electrical engineering, particularly in the area of chip packaging and electrical contacts. With a total of six patents to his name, Huettinger continues to push the boundaries of technology.

Latest Patents

Among his latest patents are innovative methods for forming chip packages and electrical contacts. One of his patents describes a method of forming an electrical contact that involves depositing a passivation layer over a metal surface using atomic layer deposition. This passivation layer includes aluminum oxide, which enhances the electrical contact with a metal contact structure made of copper. Another patent outlines a method for forming a chip package that incorporates a protective layer and a non-noble metal contact structure. This method ensures a reliable interface between the packaging material and the metal contact structure.

Career Highlights

Michael Huettinger is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work focuses on developing advanced technologies that improve the performance and reliability of electronic devices. His innovative approaches have garnered attention in the industry and contributed to the advancement of chip technology.

Collaborations

Throughout his career, Huettinger has collaborated with several talented individuals, including Joachim Mahler and Michael Bauer. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Michael Huettinger is a prominent inventor whose work in chip packaging and electrical contacts has made a significant impact in the field of electrical engineering. His innovative patents and collaborations continue to shape the future of technology.

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