The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Sep. 17, 2019
Infineon Technologies Ag, Neubiberg, DE;
Joachim Mahler, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Jochen Dangelmaier, Beratzhausen, DE;
Reimund Engl, Munich, DE;
Johann Gatterbauer, Parsberg, DE;
Frank Hille, Munich, DE;
Michael Huettinger, Munich, DE;
Werner Kanert, Holzkirchen, DE;
Heinrich Koerner, Bruckmuehl, DE;
Brigitte Ruehle, Holzkirchen, DE;
Francisco Javier Santos Rodriguez, Villach, AT;
Antonio Vellei, Villach, AT;
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Abstract
A method of forming an electrical contact and a method of forming a chip package are provided. The methods may include arranging a metal contact structure including a non-noble metal and electrically contacting the chip, arranging a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.