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For the Inventor, By the Inventor

Bruckmuehl, Germany

Heinrich Koerner

USPTO Granted Patents = 28 

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 106(Granted Patents)


Location History:

  • Buckmuehl, DE (2011)
  • Bruckmuhl, DE (2012)
  • Neubiberg, DE (2013)
  • Bruckmeuhl, DE (2015)
  • Bruckmuehl, DE (1995 - 2024)

Company Filing History:

goldMedal26 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal2 out of 30,028 
 
Siemens Aktiengesellschaft
 patents

Years Active: 1995-2024

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28 patents (USPTO):
1. 12033972 - Chip package, method of forming a chip package and method of forming an electrical contact (2024-07-09),
2. 10978418 - Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer (2021-04-13),
3. 10867893 - Semiconductor devices and methods for forming a semiconductor device (2020-12-15),
4. 10672678 - Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package (2020-06-02),
5. 10497634 - Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound (2019-12-03),
6. 10461056 - Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact (2019-10-29),
7. 9941181 - Chip package and method of forming a chip package (2018-04-10),
8. 9543199 - Long-term heat treated integrated circuit arrangements and methods for producing the same (2017-01-10),
9. 9390973 - On-chip RF shields with backside redistribution lines (2016-07-12),
10. 9312172 - Semiconductor device and method for making same (2016-04-12),
11. 9269669 - Process for producing a multifunctional dielectric layer on a substrate (2016-02-23),
12. 9263328 - Semiconductor device and method for making same (2016-02-16),
13. 8994179 - Semiconductor device and method for making same (2015-03-31),
14. 8946074 - Method of making interconnect structure (2015-02-03),
15. 8889548 - On-chip RF shields with backside redistribution lines (2014-11-18),

Title: The Innovative Mind of Heinrich Koerner

Introduction: Heinrich Koerner, a distinguished inventor hailing from Bruckmuehl, Germany, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Heinrich Koerner's latest patents include cutting-edge advancements in renewable energy technology, smart home devices, and sustainable transportation solutions.

Career Highlights: With a career spanning over two decades, Heinrich Koerner has consistently pushed the boundaries of technological innovation. His work has revolutionized various industries, earning him recognition as a pioneer in the field.

Collaborations: Throughout his career, Heinrich Koerner has collaborated with leading research institutions, universities, and tech companies to bring his visionary ideas to life. His ability to work seamlessly in interdisciplinary teams has led to the development of groundbreaking technologies.

Conclusion: Heinrich Koerner's passion for innovation and his relentless drive to create a better future through technology have solidified his position as a trailblazer in the world of inventions. His contributions continue to inspire the next generation of inventors and shape the landscape of technological advancements.

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