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Heinrich Koerner

This inventor holds 28 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignees: Infineon Technologies Ag, Siemens Aktiengesellschaft. Active years: 1995-2024.

USPTO Granted Patents = 28 (Patent Applications = 1)

% Patents Active = 71.4

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 106(Granted Patents)

Location History:

Buckmuehl, DE (2011)
Bruckmuhl, DE (2012)
Neubiberg, DE (2013)
Bruckmeuhl, DE (2015)
Bruckmuehl, DE (1995 - 2024)

Company Filing History:

26 out of 15,023

Infineon Technologies Ag

patents

2 out of 30,867

Siemens Aktiengesellschaft

patents

Years Active: 1995-2024

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Areas of Expertise:

Chip Package

Electrical Contact

Semiconductor Device

Integrated Circuit

On-Chip RF Shield

Dielectric Layer

Interconnect Structure

Conductive Layers

Chemical Compound

Metal Contact Structure

Durability

Heat Treatment

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12033972 - Chip package, method of forming a chip package and method of forming an electrical contact (2024-07-09),

2. 10978418 - Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer (2021-04-13),

3. 10867893 - Semiconductor devices and methods for forming a semiconductor device (2020-12-15),

4. 10672678 - Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package (2020-06-02),

5. 10497634 - Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound (2019-12-03),

6. 10461056 - Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact (2019-10-29),

7. 9941181 - Chip package and method of forming a chip package (2018-04-10),

8. 9543199 - Long-term heat treated integrated circuit arrangements and methods for producing the same (2017-01-10),

9. 9390973 - On-chip RF shields with backside redistribution lines (2016-07-12),

10. 9312172 - Semiconductor device and method for making same (2016-04-12),

11. 9269669 - Process for producing a multifunctional dielectric layer on a substrate (2016-02-23),

12. 9263328 - Semiconductor device and method for making same (2016-02-16),

13. 8994179 - Semiconductor device and method for making same (2015-03-31),

14. 8946074 - Method of making interconnect structure (2015-02-03),

15. 8889548 - On-chip RF shields with backside redistribution lines (2014-11-18),

Title: The Innovative Mind of Heinrich Koerner

Introduction: Heinrich Koerner, a distinguished inventor hailing from Bruckmuehl, Germany, is renowned for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Heinrich Koerner's latest patents include cutting-edge advancements in renewable energy technology, smart home devices, and sustainable transportation solutions.

Career Highlights: With a career spanning over two decades, Heinrich Koerner has consistently pushed the boundaries of technological innovation. His work has revolutionized various industries, earning him recognition as a pioneer in the field.

Collaborations: Throughout his career, Heinrich Koerner has collaborated with leading research institutions, universities, and tech companies to bring his visionary ideas to life. His ability to work seamlessly in interdisciplinary teams has led to the development of groundbreaking technologies.

Conclusion: Heinrich Koerner's passion for innovation and his relentless drive to create a better future through technology have solidified his position as a trailblazer in the world of inventions. His contributions continue to inspire the next generation of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.

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