The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2016

Filed:

Feb. 23, 2012
Applicants:

Johann Helneder, Landsham, DE;

Markus Schwerd, Hoehenkirchen, DE;

Thomas Goebel, Bejing, CN;

Andrea Mitchell, Munich, DE;

Heinrich Koerner, Bruckmuehl, DE;

Martina Hommel, Munich, DE;

Inventors:

Johann Helneder, Landsham, DE;

Markus Schwerd, Hoehenkirchen, DE;

Thomas Goebel, Bejing, CN;

Andrea Mitchell, Munich, DE;

Heinrich Koerner, Bruckmuehl, DE;

Martina Hommel, Munich, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); H01L 23/532 (2006.01); C23C 14/22 (2006.01); C23C 16/44 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53238 (2013.01); C23C 14/22 (2013.01); C23C 16/44 (2013.01); H01L 21/76834 (2013.01); H01L 21/76888 (2013.01); H01L 23/5228 (2013.01); H01L 23/53223 (2013.01);
Abstract

A multifunctional dielectric layer can be formed on a substrate, especially on an exposed metallic strip conductor system on a substrate. An additional metal layer is formed across the surface of the exposed metal strip conductors. The metal layer is then at least partially converted to a nonconducting metal oxide, the dielectric layer.


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