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For the Inventor, By the Inventor

Munich, Germany

Thomas Goebel

USPTO Granted Patents = 14


Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 152(Granted Patents)


Location History:

  • Regensburg, DE (2004)
  • Fishkill, NY (US) (2004 - 2010)
  • München, DE (2009 - 2013)
  • Munich, DE (2005 - 2016)
  • Bejing, CN (2016)

Company Filing History:

goldMedal14 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal1 out of 164,108 
 
International Business Machines Corporation
 patents
where one patent can have more than one assignee

Years Active: 2004-2016

where 'Filed Patents' based on already Granted Patents

14 patents (USPTO):
1. 9373596 - Passivated copper chip pads (2016-06-21),
2. 9269669 - Process for producing a multifunctional dielectric layer on a substrate (2016-02-23),
3. 8822324 - Passivated copper chip pads (2014-09-02),
4. 8367514 - Integrated circuit with capacitor and method for the production thereof (2013-02-05),
5. 7964494 - Integrated connection arrangements (2011-06-21),
6. 7858448 - Method of forming support structures for semiconductor devices (2010-12-28),
7. 7795615 - Capacitor integrated in a structure surrounding a die (2010-09-14),
8. 7692266 - Integrated circuit with capacitor and method for the production thereof (2010-04-06),
9. 7626268 - Support structures for semiconductor devices (2009-12-01),
10. 7619309 - Integrated connection arrangements (2009-11-17),
11. 6960306 - Low Cu percentages for reducing shorts in AlCu lines (2005-11-01),
12. 6943114 - Integration scheme for metal gap fill, with fixed abrasive CMP (2005-09-13),
13. 6794282 - Three layer aluminum deposition process for high aspect ratio CL contacts (2004-09-21),
14. 6720212 - Method of eliminating back-end rerouting in ball grid array packaging (2004-04-13),

Title: Thomas Goebel: Innovator in Semiconductor Technology

Introduction

Thomas Goebel is a prominent inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on enhancing the functionality and efficiency of electronic components.

Latest Patents

Among his latest patents, Goebel has developed a method for forming passivated copper chip pads. This invention describes a substrate that includes active circuitry and metal levels disposed above it. A passivation layer is placed above the last level of the metal levels, with a conductive liner in the sidewalls of an opening in the passivation layer. This conductive liner is also positioned over an exposed surface of the last level of the metal levels. Another notable patent involves a process for producing a multifunctional dielectric layer on a substrate. This dielectric layer can be formed on an exposed metallic strip conductor system, where an additional metal layer is created across the surface of the exposed metal strip conductors. This metal layer is then partially converted to a nonconducting metal oxide, resulting in the dielectric layer.

Career Highlights

Throughout his career, Thomas Goebel has worked with leading technology companies, including Infineon Technologies AG and International Business Machines Corporation (IBM). His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in the semiconductor industry.

Collaborations

Goebel has collaborated with notable colleagues such as Johann Helneder and Andrea Mitchell. These partnerships have fostered a creative environment that has led to the development of advanced technologies.

Conclusion

Thomas Goebel's contributions to semiconductor technology through his numerous patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of electronic components, paving the way for future advancements.

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