The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Dec. 23, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Oliver Aubel, Dresden, DE;
Wolfgang Hasse, Stadthagen, DE;
Martina Hommel, Nuertingen, DE;
Heinrich Koerner, Bruckmuehl, DE;
Assignee:
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76864 (2013.01); H01L 21/76843 (2013.01); H01L 21/76844 (2013.01); H01L 21/76849 (2013.01); H01L 21/76852 (2013.01); H01L 21/76858 (2013.01); H01L 21/76865 (2013.01); H01L 21/76867 (2013.01); H01L 21/76877 (2013.01); H01L 21/76885 (2013.01); H01L 21/76886 (2013.01); H01L 23/5226 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3011 (2013.01);
Abstract
An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment. Concurrently or alternatively, interconnects are coated with barrier material in a simple and uncomplicated manner by means of the long-term heat treatment.