Holzkirchen, Germany

Werner Kanert


 

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2003-2024

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7 patents (USPTO):

Title: Werner Kanert: Innovator in Chip Packaging Technology

Introduction

Werner Kanert is a notable inventor based in Holzkirchen, Germany. He has made significant contributions to the field of chip packaging technology, holding a total of seven patents. His work focuses on methods that enhance the efficiency and reliability of electrical contacts in semiconductor devices.

Latest Patents

Among his latest patents are innovative methods for forming chip packages and electrical contacts. One of his patents describes a method that involves depositing a passivation layer over a metal surface using atomic layer deposition. This passivation layer, which may include aluminum oxide, is crucial for ensuring reliable electrical contact with a metal contact structure made of copper. Another patent outlines a method for forming a chip package that incorporates a protective layer and a non-noble metal contact structure. This method emphasizes the importance of creating an interface between the packaging material and the metal contact structure, enhancing the overall performance of the chip package.

Career Highlights

Werner Kanert has built a successful career at Infineon Technologies AG, where he has been instrumental in advancing chip packaging technologies. His innovative approaches have not only contributed to the company's success but have also set new standards in the industry.

Collaborations

Throughout his career, Kanert has collaborated with esteemed colleagues such as Joachim Mahler and Michael Bauer. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Werner Kanert's contributions to chip packaging technology exemplify the impact of innovation in the semiconductor industry. His patents and collaborative efforts continue to influence the development of more efficient and reliable electronic devices.

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