The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Mar. 02, 2012
Applicants:

Dirk Meinhold, Dresden, DE;

Norbert Mais, Nuremberg, DE;

Reimund Engl, Munich, DE;

Hans-joerg Timme, Ottobrunn, DE;

Alfred Vater, Dresden, DE;

Stephan Henneck, Regensburg, DE;

Norbert Urbansky, Dresden, DE;

Inventors:

Dirk Meinhold, Dresden, DE;

Norbert Mais, Nuremberg, DE;

Reimund Engl, Munich, DE;

Hans-Joerg Timme, Ottobrunn, DE;

Alfred Vater, Dresden, DE;

Stephan Henneck, Regensburg, DE;

Norbert Urbansky, Dresden, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/488 (2006.01); H01L 21/283 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a method of forming a semiconductor device includes forming a metal line over a substrate and depositing an alloying material layer over a top surface of the metal line. The method further includes forming a protective layer by combining the alloying material layer with the metal line.


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