The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Sep. 14, 2007
Applicants:

Henrik Ewe, Burglengenfeld, DE;

Joachim Mahler, Regensburg, DE;

Manfred Mengel, Bad Abbach, DE;

Reimund Engl, Regensburg, DE;

Josef Hoeglauer, Munich, DE;

Jochen Dangelmaier, Beratzhausen, DE;

Inventors:

Henrik Ewe, Burglengenfeld, DE;

Joachim Mahler, Regensburg, DE;

Manfred Mengel, Bad Abbach, DE;

Reimund Engl, Regensburg, DE;

Josef Hoeglauer, Munich, DE;

Jochen Dangelmaier, Beratzhausen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/25 (2013.01); H01L 21/4821 (2013.01); H01L 21/6835 (2013.01); H01L 23/3107 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/24011 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/24051 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/82001 (2013.01); H01L 2224/82039 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01068 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82102 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/24246 (2013.01); H01L 2224/32145 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/12032 (2013.01);
Abstract

A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness.


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