Recai Sezi

This inventor holds 83 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging (CPC class 430326). Top assignees: Siemens Aktiengesellschaft, Infineon Technologies Ag, Intel Mobile Communications Gmbh. Active years: 1988-2017.

USPTO Granted Patents = 83 (Patent Applications = 1)

% Patents Active = 66.3

Average Co-Inventor Count = 2.9

ph-index = 9

Forward Citations = 519(Granted Patents)

Forward Citations (Not Self Cited) = 480(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Rottenbach, DE (1993 - 2006)
Röttenbach, DE (2001 - 2011)
Roettenbach, DE (1988 - 2017)

Company Filing History:

41 out of 30,854

Siemens Aktiengesellschaft

patents

35 out of 15,013

Infineon Technologies Ag

patents

3 out of 511

Intel Mobile Communications Gmbh

patents

4. 2 out of 254

Intel Deutschland Gmbh

patents

5. 1 out of 6

Osram Opto Semiconductor Gmbh Co. Ohg

Years Active: 1988-2017

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Areas of Expertise:

Semiconductor Chips

Electrostatic Discharge

Microelectronics

Polybenzoxazoles

Porous Coatings

Memory Cells

Dielectric Materials

Encapsulants

Photosensitive Formulations

Wiring Processes

Antireflective Layers

Chip-and-Wafer Stacks

83 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9601475 - Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips (2017-03-21),

2. 9293423 - Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips (2016-03-22),

3. 9093322 - Semiconductor device (2015-07-28),

4. 8779563 - Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips (2014-07-15),

5. 8741690 - Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads (2014-06-03),

6. 8309454 - Structure for electrostatic discharge in embedded wafer level packages (2012-11-13),

7. 8258633 - Semiconductor package and multichip arrangement having a polymer layer and an encapsulant (2012-09-04),

8. 8183696 - Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads (2012-05-22),

9. 8076784 - Stacked semiconductor chips (2011-12-13),

10. 7952200 - Semiconductor device including a copolymer layer (2011-05-31),

11. 7867878 - Stacked semiconductor chips (2011-01-11),

12. 7746683 - NOR and NAND memory arrangement of resistive memory elements (2010-06-29),

13. 7687895 - Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips (2010-03-30),

14. 7476412 - Method for the metalization of an insulator and/or a dielectric (2009-01-13),

15. 7273821 - Method for producing a porous coating (2007-09-25),

Title: The Innovative Mind of Recai Sezi

Introduction: Recai Sezi, a talented inventor hailing from Roettenbach, Germany, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Recai Sezi's latest patents include cutting-edge advancements in renewable energy technologies, smart home devices, and artificial intelligence systems.

Career Highlights: Throughout his illustrious career, Recai Sezi has been recognized for his exceptional problem-solving skills and his ability to transform creative ideas into practical solutions. He has received numerous awards for his innovative work in various industries.

Collaborations: Recai Sezi has collaborated with leading research institutions, universities, and tech companies to further develop his inventions and bring them to the market. His collaborative efforts have resulted in the successful implementation of several groundbreaking technologies.

Conclusion: Recai Sezi's passion for innovation and his dedication to pushing the boundaries of technology have solidified his reputation as a visionary inventor in the global innovation landscape.