The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2011
Filed:
Oct. 14, 2010
Markus Brunnbauer, Lappersdorf, DE;
Recai Sezi, Roettenbach, DE;
Thorsten Meyer, Regensburg, DE;
Gottfried Beer, Nittendorf, DE;
Markus Brunnbauer, Lappersdorf, DE;
Recai Sezi, Roettenbach, DE;
Thorsten Meyer, Regensburg, DE;
Gottfried Beer, Nittendorf, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.