The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Mar. 31, 2010
Thorsten Meyer, Regensburg, DE;
Rainer Leuschner, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Reinhard Hess, Straubing, DE;
Recai Sezi, Roettenbach, DE;
Thorsten Meyer, Regensburg, DE;
Rainer Leuschner, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Reinhard Hess, Straubing, DE;
Recai Sezi, Roettenbach, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, wherein x is the pitch of the second contact pads in micrometers.