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For the Inventor, By the Inventor

Straubing, Germany

Reinhard Hess

This inventor holds 5 USPTO granted patents. Top assignee: Infineon Technologies Ag. Active years: 2012-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Reinhard Hess. Retrieved from https://idiyas.com/inventor/reinhard-hess

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5

% Patents Active = 60.0

Average Co-Inventor Count = 5.3

ph-index = 3

Forward Citations = 58(Granted Patents)


Company Filing History:

goldMedal5 out of 15,027 
 
Infineon Technologies Ag
 patents

Years Active: 2012-2017

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5 patents (USPTO):Explore Patents
1. 9576875 - Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements (2017-02-21),
2. 9356092 - Semiconductor device and method for manufacturing a semiconductor device (2016-05-31),
3. 8951915 - Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements (2015-02-10),
4. 8741690 - Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads (2014-06-03),
5. 8183696 - Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads (2012-05-22),

Title: Reinhard Hess: Innovator in Semiconductor Technology

Introduction

Reinhard Hess is a notable inventor based in Straubing, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods for manufacturing chip arrangements and packages, which are crucial for the advancement of electronic devices.

Latest Patents

Hess's latest patents include several groundbreaking methods. One of his patents details a method for manufacturing a chip arrangement, which involves forming a hole in a carrier that includes at least one chip. This method selectively removes carrier material to create a cavity, followed by the application of passivation material over the cavity walls. Another patent describes a method for manufacturing a semiconductor device, which includes providing a semiconductor wafer with multiple chips and forming intersecting scribe lines to enhance the manufacturing process.

Career Highlights

Reinhard Hess is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of technology and contribute to the development of advanced semiconductor devices.

Collaborations

Hess has collaborated with notable colleagues such as Thorsten Meyer and Rainer Leuschner. Their combined expertise has fostered innovation and progress in the semiconductor industry.

Conclusion

Reinhard Hess is a prominent figure in semiconductor technology, with a strong portfolio of patents that reflect his innovative spirit. His contributions continue to shape the future of electronic devices and manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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