logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9293423 B1

PDFFull Text
Date of Patent:
Mar. 22, 2016

Filed:

Jul. 14, 2014

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Applicant:

Intel Mobile Communications Gmbh, Neubiberg, DE;

Inventors:

Markus Brunnbauer, Lappersdorf, DE;

Thorsten Meyer, Regensburg, DE;

Stephan Bradl, Regensburg, DE;

Ralf Plieninger, Poing, DE;

Jens Pohl, Bernhardswald, DE;

Klaus Pressel, Regensburg, DE;

Recai Sezi, Roettenbach, DE;

Assignee:

Intel Deutschland GmbH, Neubiberg, DE;

Attorney:

Eschweiler & Associates, LLC

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/60 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/48 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/20 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1617 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

Find Patent Forward Citations

Brunnbauer, Markus. (2016). Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips (U.S. Patent No. 9293423). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9293423

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…