Gyeonggi-do, South Korea

Qwan Ho Chung

This inventor holds 31 USPTO granted patents and 6 published patent applications, primarily in Semiconductor Packaging. Top assignees: Hynix Semiconductor Inc., Skhynix Inc.. Active years: 2008-2017.

USPTO Granted Patents = 31 

% Patents Active = 77.4

Average Co-Inventor Count = 1.6

ph-index = 3

Forward Citations = 78(Granted Patents)


Location History:

  • Kyoungki-do, KR (2008 - 2009)
  • Gyeonggi-do, KR (2009 - 2013)
  • Seoul, KR (2014 - 2017)

Company Filing History:


Years Active: 2008-2017

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Areas of Expertise:
Semiconductor Package
EMI Shielding
Embedded Packages
Heat Dissipation
Ball Lands
Stacked Devices
Through-Silicon Via
Circuit Boards
Chip Selection
Wafer Level Package
Bumps
Electrical Characteristics
31 patents (USPTO):Explore Patents

Title: **Qwan Ho Chung: Innovator in Semiconductor Packaging**

Introduction

Qwan Ho Chung is a distinguished inventor based in Gyeonggi-do, South Korea, with an impressive portfolio of 31 patents. His contributions to the field of semiconductor packaging have significantly advanced the technology, demonstrating his expertise and innovative capabilities.

Latest Patents

Among his recent patents, one titled "Electrical characteristics of package substrates and semiconductor packages including the same" focuses on the design of package substrates that enhance electrical performance. This package substrate features a power line and a ground line strategically placed on its first surface, along with a plurality of signal lines positioned between them. Notably, it incorporates a lower ground pattern and a lower power pattern on the opposite side, improving signal integrity.

Another patent, titled "Semiconductor package and method for manufacturing the same," outlines a method for producing semiconductor packages. This method involves the development of a strip substrate composed of multiple unit substrates, each equipped with connection pads and formed with unique electrical isolation characteristics. This innovation streamlines the manufacturing process and promotes efficiency in semiconductor packaging.

Career Highlights

Qwan Ho Chung has made significant strides in the semiconductor industry, having worked with reputable companies such as Hynix Semiconductor Inc. and SK Hynix Inc. His experience in these organizations has allowed him to harness advanced technologies and contribute to cutting-edge innovations in semiconductor applications.

Collaborations

Throughout his career, Chung has collaborated with notable colleagues, including Woong Hee Lee and Seung Jee Kim. Their collective expertise and teamwork fostered advancements and innovations that have benefited the semiconductor sector.

Conclusion

Qwan Ho Chung is an influential figure in the field of semiconductor technology. His innovative patents and collaborative efforts are paving the way for future advancements in the industry, marking him as a key player in the ongoing evolution of semiconductor packaging solutions.

Profile summary based on public USPTO records.
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