The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Nov. 04, 2014
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Seung Jee Kim, Seongnam-si, KR;
Qwan Ho Chung, Seoul, KR;
Jong Hyun Nam, Seoul, KR;
Si Han Kim, Yongin-si, KR;
Sang Yong Lee, Icheon-si, KR;
Seong Cheol Shin, Daegu, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/768 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/19 (2013.01); H01L 24/83 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 24/13 (2013.01); H01L 2224/02333 (2013.01); H01L 2224/02351 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/03334 (2013.01); H01L 2224/03472 (2013.01); H01L 2224/03474 (2013.01); H01L 2224/03903 (2013.01); H01L 2224/03906 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11602 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/211 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract
An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.