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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9209146 B1

PDFFull Text
Date of Patent:
Dec. 08, 2015

Filed:

Nov. 04, 2014

Electronic device packages having bumps and methods of manufacturing the same

Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventors:

Seung Jee Kim, Seongnam-si, KR;

Qwan Ho Chung, Seoul, KR;

Jong Hyun Nam, Seoul, KR;

Si Han Kim, Yongin-si, KR;

Sang Yong Lee, Icheon-si, KR;

Seong Cheol Shin, Daegu, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:

William Park & Associates Ltd.

Primary Examiner:

Bilkis Jahan

Assistant Examiner:

Kevin Quinto

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 21/768 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/19 (2013.01); H01L 24/83 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 24/13 (2013.01); H01L 2224/02333 (2013.01); H01L 2224/02351 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/03334 (2013.01); H01L 2224/03472 (2013.01); H01L 2224/03474 (2013.01); H01L 2224/03903 (2013.01); H01L 2224/03906 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11602 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/211 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip.

Find Patent Forward Citations

Kim, Seung. (2015). Electronic device packages having bumps and methods of manufacturing the same (U.S. Patent No. 9209146). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9209146

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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