Jong Hyun Nam

USPTO Granted Patents = 25 (Patent Applications = 10)

CIPO Patents = 4 (Patent Applications = 3)

EPO Patents = 4 (Patent Applications = 8)

Average Co-Inventor Count = 1.4

ph-index = 4

Forward Citations = 48(Granted Patents)

Location History:

Seoul KR (1999)
Gyeonggi-do, KR (2010 - 2013)
Icheon-si, KR (2013 - 2014)
Icheon-si Gyeonggi-do, KR (2015)
Seoul, KR (2011 - 2023)

Company Filing History:

Hynix Semiconductor Inc.

patents

7 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1999-2025

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25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12478653 - Composition for prevention, alleviation, or treatment of atopic dermatitis disease (2025-11-25),

2. 12290547 - Stamina-improving composition and stamina-improving natural tea comprising same (2025-05-06),

3. 11666810 - Putter including interchangeable sleeve mechanism capable of easily replacing and mounting shaft (2023-06-06),

4. 10559539 - Wafer level packages, semiconductor device units, and methods of fabricating the same (2020-02-11),

5. 9905540 - Fan-out packages including vertically stacked chips and methods of fabricating the same (2018-02-27),

6. 9565763 - Printed circuit boards having supporting patterns and method of fabricating the same (2017-02-07),

7. 9324688 - Embedded packages having a connection joint group (2016-04-26),

8. 9324686 - Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same (2016-04-26),

9. 9293443 - Chip stack packages, methods of fabricating the same, electronic systems including the same and memory cards including the same (2016-03-22),

10. 9209150 - Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same (2015-12-08),

11. 9209146 - Electronic device packages having bumps and methods of manufacturing the same (2015-12-08),

12. 9184147 - Stacked semiconductor package (2015-11-10),

13. 9153557 - Chip stack embedded packages (2015-10-06),

14. 8907487 - Electronic device packages having bumps and methods of manufacturing the same (2014-12-09),

15. 8866269 - Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same (2014-10-21),

Title: Innovations of Jong Hyun Nam: A Visionary Inventor from Seoul

Introduction

Jong Hyun Nam is an eminent inventor based in Seoul, South Korea, with a remarkable portfolio of 23 patents. His inventive spirit is evident through his contributions to both the sports equipment and semiconductor device sectors. His work not only showcases his technical expertise but also his commitment to advancing technology and enhancing user experience.

Latest Patents

Among his latest innovations is a putter that features an interchangeable sleeve mechanism, designed for easily replacing and mounting the shaft. This putter is comprised of a main body, a downward extension part, and a blade formation that extends rearward with multiple weight mounting grooves to precisely adjust the putter's balance. Additionally, he has developed wafer level packages and semiconductor device units. These devices improve the arrangement and performance of semiconductor chips, incorporating a reinforcement zig and a molded layer for increased efficiency and protection.

Career Highlights

Jong Hyun Nam's career is marked by his association with leading technology companies, including SK Hynix Inc. His experience in the fields of semiconductor technology and sports equipment has positioned him as a valuable contributor to innovation. His patents reflect a deep understanding of engineering principles and a passion for problem-solving.

Collaborations

Throughout his career, he has collaborated with talented individuals like Seung Jee Kim and Sang Yong Lee. These partnerships have facilitated the exchange of ideas and expertise, further enhancing the innovative processes behind their projects.

Conclusion

Jong Hyun Nam continues to inspire with his innovative mindset and dedication to improving technology. His achievements in patenting new inventions not only benefit the industries he works in but also contribute to the global landscape of innovation. As he builds on his previous successes, the future holds great promise for more groundbreaking advancements from this talented inventor.

This text is generated by artificial intelligence and may not be accurate.