The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Nov. 17, 2017
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventor:
Jong Hyun Nam, Seoul, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/3157 (2013.01); H01L 23/5386 (2013.01); H01L 2224/18 (2013.01);
Abstract
A wafer level package and or a semiconductor device unit may be provided. The wafer level package may include semiconductor chips disposed on an interconnection structure layer and laterally spaced apart from each other. The wafer level package may include a reinforcement zig attached to the semiconductor chips. The wafer level package may include a molded layer covering the semiconductor chips and embedding the reinforcement zig. Related methods are also provided.