The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Nov. 20, 2013
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Sang Yong Lee, Icheon-si, KR;
Qwan Ho Chung, Seoul, KR;
Seung Jee Kim, Seongnam-si, KR;
Jong Hyun Nam, Seoul, KR;
Si Han Kim, Yongin-si, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/25 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8203 (2013.01); H01L 2224/92244 (2013.01);
Abstract
Embedded packages are provided. The embedded package includes a chip attached to a first surface of a core layer, a plurality of bumps on a surface of the chip opposite to the core layer, and a first insulation layer surrounding the core layer, the chip and the plurality of bumps. The first insulation layer has a trench disposed in a portion of the first insulation layer to expose the plurality of bumps.