The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Dec. 29, 2010
Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package
Ki Young Kim, Seongnam-si, KR;
Qwan Ho Chung, Seoul, KR;
Sung Ho Hyun, Seoul, KR;
Myung Gun Park, Seoul, KR;
Jin Ho Bae, Icheon-si, KR;
Ki Young Kim, Seongnam-si, KR;
Qwan Ho Chung, Seoul, KR;
Sung Ho Hyun, Seoul, KR;
Myung Gun Park, Seoul, KR;
Jin Ho Bae, Icheon-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile