The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
May. 29, 2014
Applicant:
SK Hynix Inc., Icheon, KR;
Inventor:
Qwan Ho Chung, Seoul, KR;
Assignee:
SK HYNIX INC., Icheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/50 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 21/76802 (2013.01); H01L 23/3135 (2013.01); H01L 23/3164 (2013.01); H01L 23/50 (2013.01); H01L 24/97 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/12042 (2013.01);
Abstract
A semiconductor package includes a dielectric layer in which a chip is embedded, interconnection parts disposed on a first surface of the dielectric layer, through connectors each of which penetrates a portion of the dielectric layer over the chip to electrically couple the chip to a corresponding one of the interconnection parts, a shielding plate covering a second surface of the dielectric layer that is opposite to the first surface, and a shielding encapsulation part connected to one of the interconnection parts and covering sidewalls of the dielectric layer. The shielding encapsulation part includes a portion contacting the shielding plate.