Company Filing History:
17 out of 682 
1 out of 2,062 
Years Active: 1997-2009
Title: Innovator Spotlight: Quinn K Tong
Introduction
Quinn K Tong is a prominent inventor based in Belle Mead, NJ, recognized for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 18 patents to his name, Tong has demonstrated a continuous commitment to innovation, particularly in developing advanced encapsulant compositions for electronic applications.
Latest Patents
Among his latest innovations are two noteworthy patents related to underfill encapsulants. The first patent, "B-stageable underfill encapsulant and method for its application," highlights a curable underfill encapsulant composition designed to be applied directly onto semiconductor wafers prior to dicing. This composition features a thermally curable resin system, which includes epoxy resin, a phenol-containing compound, a solvent, and an imidazole phosphate salt catalyst, among other components. The result is a smooth, non-tacky coating that allows for clean dicing of the wafers into individual chips.
The second patent, "Underfill encapsulant for wafer packaging and method for its application," outlines a similar approach using a thermally curable epoxy resin and an imidazole-anhydride curing agent. This technology further enhances the reliability of electronic packaging, ensuring that chips can be affixed securely to substrates without complications during the manufacturing process.
Career Highlights
Quinn K Tong has amassed a wealth of experience throughout his career, working with reputable companies such as National Starch and Chemical Investment Holding Corporation and Henkel AG & Company, KGaA. His work has consistently focused on improving semiconductor manufacturing processes, solidifying his status as a key player in the industry.
Collaborations
Throughout his career, Tong has collaborated with talented individuals such as Bodan Ma and Bing T Wu. These partnerships have fostered an environment of creativity and innovation, often leading to groundbreaking developments in his field.
Conclusion
Quinn K Tong stands out as a distinguished inventor with a passion for advancing technology in the semiconductor sector. His extensive patent portfolio reflects a profound understanding of material science and engineering, paving the way for future innovations in electronic packaging. As he continues to develop new ideas and products, the impact of his inventions will undoubtedly shape the industry for years to come.