The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2000
Filed:
Jul. 02, 1998
Applicant:
Inventors:
Bodan Ma, Weehawken, NJ (US);
Quinn K Tong, Belle Mead, NJ (US);
Chaodong Xiao, East Hanover, NJ (US);
Assignee:
National Starch and Chemical Investment Holding Corporation, Wilmington, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; C08F / ; H02G / ;
U.S. Cl.
CPC ...
522 99 ; 522 96 ; 522 90 ; 522104 ; 522107 ; 522148 ; 174 521 ; 174 522 ; 438107 ; 438108 ; 438118 ; 438127 ; 29841 ; 29 2501 ;
Abstract
A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.