The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2002

Filed:

Feb. 13, 2001
Applicant:
Inventors:

Chih-Min Cheng, Lowell, MA (US);

Gerald Fredrickson, Westford, MA (US);

Yue Xiao, Belle Mead, NJ (US);

Quinn K. Tong, Belle Mead, NJ (US);

Daoqiang Lu, Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 ;
U.S. Cl.
CPC ...
H01B 1/22 ;
Abstract

An composition with improved electrical stability for use in microelectronic applications comprises a polymeric resin, a conductive filler, optionally either a reactive or a nonreactive diluent, optionally an inert filler, and an oxygen scavenger or corrosion inhibitor or both to provide the electrical stability. Alternatively, the composition may also include a low melting point metal filler component.


Find Patent Forward Citations

Cheng, Chih-Min. (2002). Conductive and resistive materials with electrical stability for use in electronics devices (U.S. Patent No. 6344157). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6344157

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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