The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2004
Filed:
Dec. 14, 2001
Applicant:
Inventors:
Bodan Ma, Hillsborough, NJ (US);
Sun Hee Hong, Hillsborough, NJ (US);
Quinn K. Tong, Belle Mead, NJ (US);
Assignee:
National Starch and Chemical Investment Holding Corporation, New Castle, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/328 ; H01L 2/329 ;
U.S. Cl.
CPC ...
H01L 2/328 ; H01L 2/329 ;
Abstract
A silicon wafer has a B-stageable underfill material deposited on the active face of the wafer. The B-stageable underfill comprises a first composition with a lower curing temperature and a second composition with a higher curing temperature, characterized in that the first composition has been fully cured.