Company Filing History:
Years Active: 2004-2006
Title: Innovator Spotlight: Sun Hee Hong and His Contributions to Semiconductor Packaging
Introduction: Sun Hee Hong is an accomplished inventor based in Hillsborough, NJ, recognized for his innovative contributions to the field of semiconductor packaging. With a total of two patents to his name, Hong has developed advanced materials and methods that enhance the efficiency and reliability of electronic devices.
Latest Patents: Hong's latest innovations include two significant patents: the "Underfill encapsulant for wafer packaging and method for its application" and "Dual cure B-stageable underfill for wafer level." The first patent describes a curable underfill encapsulant composition applied directly onto semiconductor wafers prior to dicing. This composition features a thermally curable epoxy resin, a solvent, an imidazole-anhydride curing agent, and various additives, ensuring a smooth, non-tacky coating for clean dicing into individual chips.
The second patent presents a dual cure B-stageable underfill material deposited on the active face of silicon wafers. It combines two compositions with different curing temperatures, allowing for greater flexibility and efficiency in the production of electronic packages.
Career Highlights: Sun Hee Hong is employed at National Starch and Chemical Investment Holding Corporation, where he has played a vital role in developing industry-leading materials for semiconductor applications. His innovations have contributed to improving the performance and reliability of electronic devices in various markets.
Collaborations: Throughout his career, Hong has collaborated with talented professionals such as Bodan Ma and Quinn K Tong, fostering an environment of creativity and innovation. Together, they have worked on advancing semiconductor packaging technologies, pushing the boundaries of what is possible in the industry.
Conclusion: Sun Hee Hong's work exemplifies the spirit of innovation in the semiconductor field. His patents highlight the importance of advanced materials in improving electronic devices' performance and reliability. With his ongoing contributions and collaborations, Hong continues to shape the future of technology in significant ways.