The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2000
Filed:
Jul. 02, 1998
Applicant:
Inventors:
Bodan Ma, Weehawken, NJ (US);
Quinn K Tong, Belle Mead, NJ (US);
Assignee:
National Starch and Chemical Investment Holding Corporation, Wilmington, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F / ; C08F / ; C08G / ; C08K / ;
U.S. Cl.
CPC ...
522 96 ; 522 99 ; 522 90 ; 522104 ; 522107 ; 522148 ; 522156 ; 525282 ; 523400 ; 523435 ; 548521 ;
Abstract
A curable underfill encapsulant composition, suitable for use in semiconductor packaging, comprises one or more mono- or polyfunctional maleimide compounds, or one or more mono- or polyfunctional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, with a free radical curing agent, and optionally, one or more fillers.
Ma, Bodan. (2000). Underfill encapsulant compositions for use in electronic devices (U.S. Patent No. 6063828). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6063828
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile