The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2009
Filed:
Nov. 21, 2005
Allison Yue Xiao, Belle Mead, NJ (US);
Quinn K. Tong, Belle Mead, NJ (US);
Bodan MA, Racine, WI (US);
Gyanendra Dutt, Piscataway, NJ (US);
Allison Yue Xiao, Belle Mead, NJ (US);
Quinn K. Tong, Belle Mead, NJ (US);
Bodan Ma, Racine, WI (US);
Gyanendra Dutt, Piscataway, NJ (US);
Henkel AG & Co. KGaA, Düsseldorf, DE;
Abstract
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole phosphate salt catalyst, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.