Gyanendra Dutt

Title: Gyanendra Dutt: Innovator in Semiconductor Technology

Introduction

Gyanendra Dutt is a notable inventor based in Piscataway, NJ (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to underfill encapsulants.

Latest Patents

Gyanendra Dutt holds a patent for a B-stageable underfill encapsulant and method for its application. This invention involves a curable underfill encapsulant composition that is applied directly onto semiconductor wafers before they are diced into individual chips. The composition includes a thermally curable resin system comprising an epoxy resin, a phenol-containing compound, a solvent, an imidazole phosphate salt catalyst, inorganic fillers, and fluxing agents. Additionally, various additives such as defoaming agents, adhesion promoters, flow additives, and rheology modifiers may be included. The underfill encapsulant is designed to be B-stageable, providing a smooth, non-tacky coating on the wafer that allows for clean dicing into individual chips.

Career Highlights

Gyanendra Dutt is currently employed at Henkel Ag & Company, Kgaa, where he continues to develop innovative solutions in the semiconductor industry. His work has been instrumental in advancing the technology used in electronic packaging.

Collaborations

Throughout his career, Gyanendra has collaborated with talented individuals such as Allison Yue Xiao and Quinn K Tong. These collaborations have contributed to the successful development of his innovative technologies.

Conclusion

Gyanendra Dutt's contributions to semiconductor technology through his patent on B-stageable underfill encapsulants highlight his role as an influential inventor in the field. His work continues to impact the industry positively.