The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
May. 23, 2003
Jayesh Shah, Plaistow, NH (US);
Brian Wheelock, Sandown, NH (US);
Quinn K. Tong, Belle Mead, NJ (US);
Jayesh Shah, Plaistow, NH (US);
Brian Wheelock, Sandown, NH (US);
Quinn K. Tong, Belle Mead, NJ (US);
National Starch and Chemical Investment Holding Corporation, New Castle, DE (US);
Abstract
The present invention relates to a pressure sensitive fluxing underfill composition that may be pre-applied to electronic components, such as CSP's, in order to increase the reliability of the component against mechanical stresses such as impact and bending. The composition contains an epoxy resin, a solid anhydride curing agent, and catalyst. Other materials, such as air release agents and fillers, may also be added as desired. The composition may be applied selectively to parts of the CSP, for example to the solder bumps. The composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.