Brian Wheelock

Introduction

Brian Wheelock, an inventive engineer based in Sandown, New Hampshire, has made significant contributions to the field of electronic component reliability. With a total of two patents to his name, he continues to push the boundaries of innovation in his industry.

Latest Patents

Wheelock's recent patents reflect his expertise in developing advanced materials for electronic applications. His latest invention, the "Pre-applied fluxing underfill composition having pressure sensitive adhesive properties," pertains to a composition that enhances the robustness of electronic components like Chip Scale Packages (CSP). This inventive underfill composition includes an epoxy resin, a solid anhydride curing agent, and a catalyst to withstand mechanical stresses such as impact and bending. It also allows for selective application to solder bumps, providing sufficient tack for assembly integrity.

In addition, Wheelock has patented a "No-flow underfill encapsulant," which is particularly useful in no-flow underfill encapsulation processes. This curable composition features an epoxy resin, a fluxing agent, a linear polyanhydride, and a catalyst, with optional additives such as surfactants and coupling agents to enhance performance.

Career Highlights

Brian Wheelock has been a part of the National Starch and Chemical Investment Holding Corporation, where he has contributed to the development of innovative encapsulation materials. His work focuses on creating reliable solutions that cater to the evolving demands of electronic manufacturing.

Collaborations

Throughout his career, Wheelock has collaborated with esteemed colleagues such as Jayesh P Shah and Paul L Morganelli. This teamwork has fostered an environment of creativity and innovation, leading to the development of effective and efficient technological solutions.

Conclusion

Brian Wheelock's contributions to the industry through his patents exemplify the spirit of innovation. As he continues to refine and develop new materials, his work stands as a testament to the importance of reliability in electronic components, paving the way for future advancements in technology.