The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 1998
Filed:
Feb. 25, 1997
Applicant:
Inventors:
Bing Wu, Marina Del Rey, CA (US);
Quinn K Tong, Belle Mead, NJ (US);
Robert W Humphreys, Annandale, NJ (US);
Assignee:
National Starch and Chemical Investment Holding Corporation, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; C08G / ; C08G / ;
U.S. Cl.
CPC ...
528101 ; 156 90 ; 15624412 ; 15624424 ; 1563073 ; 1563075 ; 1563077 ; 156330 ; 428413 ; 428416 ; 428418 ; 428626 ;
Abstract
For use in microelectronics applications, an improvement to an epoxy resin composition to reduce bleeding of the composition when it is applied to a silicon or metal substrate consists in the addition to the composition of a polyhydroxyl compound having two or three hydroxyl groups, or of a monohydroxyl compound that also contains one or more phenyl groups. The hydroxyl compound is present in the composition in a ratio by weight to the flexibilizing compound of from 1:3 to 1:10.