Peter Howard Spalding

This inventor holds 20 USPTO granted patents, primarily in Leadless Packaging Design. Top assignee: National Semiconductor Corporation. Active years: 1997-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Peter Howard Spalding. Retrieved from https://idiyas.com/inventor/peter-howard-spalding

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 11

Forward Citations = 560(Granted Patents)

Company Filing History:

20 out of 4,791

National Semiconductor Corporation

patents

Years Active: 1997-2005

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Areas of Expertise:

Leadless Packaging

Conductive Substrate

Structural Integrity

Semiconductor Devices

Multi-Chip Packages

Fine Pitch Leadframe

Electrical Isolation

Lead Frame Design

Mold Compound Locking

Integrated Circuits

Burr-Free Singulation

Material Flow Diverters

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6963124 - Locking of mold compound to conductive substrate panels (2005-11-08),

2. 6933174 - Leadless leadframe package design that provides a greater structural integrity (2005-08-23),

3. 6818970 - Leadless leadframe package design that provides a greater structural integrity (2004-11-16),

4. 6808961 - Locking of mold compound to conductive substrate panels (2004-10-26),

5. 6686652 - Locking lead tips and die attach pad for a leadless package apparatus and method (2004-02-03),

6. 6677667 - Leadless leadframe package design that provides a greater structural integrity (2004-01-13),

7. 6674156 - Multiple row fine pitch leadless leadframe package with use of half-etch process (2004-01-06),

8. 6617197 - Multi row leadless leadframe package (2003-09-09),

9. 6576989 - Locking of mold compound to conductive substrate panels (2003-06-10),

10. 6551048 - Off-load system for semiconductor devices (2003-04-22),

11. 6483180 - Lead frame design for burr-free singulation of molded array packages (2002-11-19),

12. 6452255 - Low inductance leadless package (2002-09-17),

13. 6448107 - Pin indicator for leadless leadframe packages (2002-09-10),

14. 6399415 - Electrical isolation in panels of leadless IC packages (2002-06-04),

15. 6372539 - Leadless packaging process using a conductive substrate (2002-04-16),

Title: The Innovative Journey of Peter Howard Spalding

Introduction: Peter Howard Spalding is a renowned inventor based in Cupertino, CA, known for his groundbreaking contributions to the field of technology and beyond.

Latest Patents: Peter Howard Spalding holds several patents in various industries, including telecommunications, software development, and renewable energy.

Career Highlights: With a career spanning over two decades, Peter Howard Spalding has worked with leading tech companies, spearheading projects that have revolutionized the way we interact with technology on a daily basis.

Collaborations: Throughout his career, Peter Howard Spalding has collaborated with top researchers, engineers, and designers, bringing together diverse perspectives to create innovative solutions to complex problems.

Conclusion: Peter Howard Spalding's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true pioneer in the world of technology and beyond.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]