The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2003

Filed:

Nov. 15, 2001
Applicant:
Inventors:

Jaime Bayan, Palo Alto, CA (US);

Peter Howard Spalding, Cupertino, CA (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/150 ;
Abstract

A packaging arrangement is described that utilizes a conductive panel (such as a leadless leadframe) as its base. The conductive panel has a matrix of device areas that each include a plurality of rows of contacts that are located outside of a die area. Tie bars provide support for the various contacts. Some of the tie bars are arranged to extend between adjacent contacts in the same row and some of the tie bars are arranged to extend diagonally between associated contacts in adjacent rows that are not adjacent one another. During packaging, the tie bars can be severed by cutting along lines (e.g. saw streets) that run adjacent the rows after a molding operation. The described panels are particularly useful in packages having three or more rows of contacts.


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